Producing 3D Photonic and Phononic Topological Insulator

The project is focusing on defects in 3D Topological Photonic and Acoustic Materials. NSF-sponsored Wisconsin Materials Research Science and Engineering Center (MRSEC) brings together teams of researchers from diverse disciplinary backgrounds to address a critical void in knowledge. From a manufacturing point of view, the project is divided into two main parts, one is to producing insulators for microwaves, the other is to use an Stereolithography (SLA) 3D printer to produce insulators for sound waves. The microwave insulator part is roughly divided into three parts, structural design, structural fabrication, and structural characterization. Polymer Engineering Center is mainly responsible for the structural manufacturing process.